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 SI4168DY
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V) 30 RDS(on) () 0.0057 at VGS = 10 V 0.0076 at VGS = 4.5 V ID (A)a 24 13.8 nC 21 Qg (Typ.)
FEATURES
* Halogen-free * TrenchFET(R) Power MOSFET * 100 % Rg Tested * 100 % UIS Tested
APPLICATIONS * Notebook DC/DC
SO-8
S S S G 1 2 3 4 Top View S Ordering Information: SI4168DY-T1-GE3 (Lead (Pb)-free and Halogen-free) N-Channel MOSFET 8 7 6 5 D D D G D D
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current (TJ = 150 C) Pulsed Drain Current Avalanche Current Avalanche Energy TC = 25 C TC = 70 C TA = 25 C TA = 70 C L = 0.1 mH Symbol VDS VGS ID IDM IAS EAS IS Limit 30 20 24 19.4 16b, c 14b, c 70 35 61 4.7 2.1b, c 5.7 3.6 2.5b, c 1.6b, c - 55 to 150 Unit V
A
mJ A
TC = 25 C Continuous Source-Drain Diode Current TA = 25 C TC = 25 C TC = 70 C Maximum Power Dissipation TA = 25 C TA = 70 C Operating Junction and Storage Temperature Range
PD TJ, Tstg
W C
THERMAL RESISTANCE RATINGS
Parameter Maximum Junction-to-Ambientb, f Maximum Junction-to-Foot (Drain) t 10 s Steady State Symbol RthJA RthJF Typical 35 18 Maximum 50 22 Unit C/W
Notes: a. Based on TC = 25 C. b. Surface Mounted on 1" x 1" FR4 board. c. t = 10 s. d. Maximum under Steady State conditions is 85 C/W.
Document Number: 69005 S-82668-Rev. A, 03-Nov-08
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SI4168DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 C, unless otherwise noted
Parameter Static Drain-Source Breakdown Voltage VDS Temperature Coefficient VGS(th) Temperature Coefficient Gate-Source Threshold Voltage Gate-Source Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Dynamic
b
Symbol VDS VDS/TJ VGS(th)/TJ VGS(th) IGSS IDSS ID(on) RDS(on) gfs Ciss Coss Crss Qg Qgs Qgd Rg td(on) tr td(off) tf td(on) tr td(off) tf IS ISM VSD trr Qrr ta tb
Test Conditions VGS = 0 V, ID = 250 A ID = 250 A VDS = VGS , ID = 250 A VDS = 0 V, VGS = 20 V VDS = 30 V, VGS = 0 V VDS = 30 V, VGS = 0 V, TJ = 55 C VDS 5 V, VGS = 10 V VGS = 10 V, ID = 20 A VGS = 4.5 V, ID = 18 A VDS = 15 V, ID = 20 A
Min. 30
Typ.
Max.
Unit V
27 - 5.5 1 3 100 1 5 50 0.0047 0.0062 90 0.0057 0.0076
mV/C V nA A A S
Input Capacitance Output Capacitance Reverse Transfer Capacitance Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Drain-Source Body Diode Characteristics Continuous Source-Drain Diode Current Pulse Diode Forward Current Body Diode Voltage Body Diode Reverse Recovery Time Body Diode Reverse Recovery Charge Reverse Recovery Fall Time Reverse Recovery Rise Time
1720 VDS = 15 V, VGS = 0 V, f = 1 MHz VDS = 15 V, VGS = 10 V, ID = 20 A VDS = 15 V, VGS = 4.5 V, ID = 20 A f = 1 MHz VDD = 15 V, RL = 15 ID 1.0 A, VGEN = 4.5 V, Rg = 1 355 130 29 13.8 5.0 4.6 1.1 25 14 30 15 11 VDD = 15 V, RL = 15 ID 1.0 A, VGEN = 10 V, Rg = 1 9 27 9 TC = 25 C IS = 4.1 A, VGS = 0 V 0.75 25 IF = 4.1 A, dI/dt = 100 A/s, TJ = 25 C 17 13 12 2.2 40 25 45 25 20 15 40 15 4.7 70 1.2 50 35 ns 44 21 nC pF
A V ns nC ns
Notes: a. Pulse test; pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
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Document Number: 69005 S-82668-Rev. A, 03-Nov-08
SI4168DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
70 VGS = 10 thru 4 V 60 I D - Drain Current (A) I D - Drain Current (A) 50 40 VGS = 3 V 30 20 10 0 0.0 1.0 1.2
0.8 TC = 25 C 0.6
0.4 TC = 125 C
0.2
0.5
1.0
1.5
2.0
0.0 0.0
TC = - 55 C 0.5 1.0 1.5 2.0 2.5 3.0
VDS - Drain-to-Source Voltage (V)
VGS - Gate-to-Source Voltage (V)
Output Characteristics
0.008 2400
Transfer Characteristics
R DS(on) - On-Resistance ()
0.007 C - Capacitance (pF) VGS = 4.5 V 0.006 1800
Ciss
1200
0.005
VGS = 10 V
600 0.004 Crss 0 6
Coss
0.003 0 10 20 30 40 50 60 70
0
12
18
24
30
ID - Drain Current (A)
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
10 ID = 20 A VGS - Gate-to-Source Voltage (V) 8 R DS(on) - On-Resistance VDS = 7.5 V 6 VDS = 22.5 V 4 VDS = 15 V 1.5 1.7 ID = 20 A
Capacitance
VGS = 10 V (Normalized) 1.3 VGS = 4.5 V
1.1
2
0.9
0 0 6 12 18 24 30
0.7 - 50
- 25
0
25
50
75
100
125
150
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 69005 S-82668-Rev. A, 03-Nov-08
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SI4168DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
100 0.030
TJ = 150 C 1
R DS(on) - On-Resistance ()
10 I S - Source Current (A) TJ = 25 C
0.025
0.020
0.015
0.1
0.010
TJ = 125 C
0.01
TJ = - 50 C
0.005 TJ = 25 C
0.001 0.0
0.000 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 6 7 8 9 10
VSD - Source-to-Drain Voltage (V)
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
0.5 100
On-Resistance vs. Gate-to-Source Voltage
0.2 VGS(th) Variance (V)
80
Power (W)
- 0.1
60
- 0.4
ID = 1 mA
40
- 0.7 ID = 250 A - 1.0 - 50
20
- 25
0
25
50
75
100
125
150
0 0.001
0.01
0.1 Time (s)
1
10
TJ - Temperature (C)
Threshold Voltage
100 Limited by RDS(on)*
Single Pulse Power (Junction-to-Ambient)
10 s 100 s
I D - Drain Current (A)
10 1 ms 1 10 ms 100 ms 0.1 TA = 25 C Single Pulse BVDSS Limited 0.01 0.1 1 10 100 1s 10 s 100 s, DC
VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 69005 S-82668-Rev. A, 03-Nov-08
SI4168DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
30
25 I D - Drain Current (A)
20
15
10
5
0 0 25 50 75 100 125 150 TC - Case Temperature (C)
Current Derating*
8 2.0
1.6 6 Power (W) Power (W) 1.2
4
0.8
2 0.4
0 0 25 50 75 100 125 150
0.0 0 25 50 75 100 125 150
TC - Case Temperature (C)
TA - Ambient Temperature (C)
Power, Junction-to-Foot
Power, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.
Document Number: 69005 S-82668-Rev. A, 03-Nov-08
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SI4168DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 C, unless otherwise noted
1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05
PDM t1 Notes:
0.02 Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 1 Square Wave Pulse Duration (s)
t2 1. Duty Cycle, D =
t1 t2 2. Per Unit Base = RthJA = 85 C/W 3. TJM - TA = PDMZthJA(t) 4. Surface Mounted
10
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1 Duty Cycle = 0.5 Normalized Effective Transient Thermal Impedance
0.2 0.1 0.1 0.05 0.02
Single Pulse 0.01 10 -4 10 -3 10 -2 10 -1 Square Wave Pulse Duration (s) 1 10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see http://www.vishay.com/ppg?69005.
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Document Number: 69005 S-82668-Rev. A, 03-Nov-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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